Techincal Specification:
MAJOR COMPONENTS | PRINTED WIRING BOARD 1; RESISTOR,VARIABLE,WIRE-WOUND 1; RESISTOR,FIXED,COMPOSITION 36; RESISTOR,FIXED,FILM 3; CAPACITOR,FIXED,CERAMIC DIEL 14; CAPACITOR,FIXED,ELECTROLYTIC 3; SEMICONDUCTOR DEVICE,DIODE 23; SEMICONDUCTOR DEVICE,XSTR 2; TRANSISTOR,RCA POWER 2; MICROCIRCUIT,LINEAR 2; XFMR,DRIVE 1; XFMR,AUXILL 1 |
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