Techincal Specification:
MAJOR COMPONENTS | MICROCIRCUIT,DIGITAL 21; MICROCIRCUIT,LINEAR 12; SEMICONDUCTOR DEVICE,DIODE 99; PRINTED WIRING BOARD 1; CONNECTOR,HEADER 1; CARD EJECTOR 2; RESISTOR,FIXED,COMPOSITION 3; RESISTOR,NETWORK,FIXED FILM 8; RESISTOR,FIXED,WIRE-WOUND 2; CAPACITOR,FIXED,CERAMIC 50 |
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