| BODY HEIGHT | 1.6 MILLIMETERS MAXIMUM |
| BODY LENGTH | 19.9 MILLIMETERS MINIMUM AND 20.1 MILLIMETERS MAXIMUM |
| BODY WIDTH | 13.9 MILLIMETERS MINIMUM AND 14.1 MILLIMETERS MAXIMUM |
| CASE OUTLINE SOURCE AND DESIGNATOR | MS-026BHB JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| FEATURES PROVIDED | ASYNCHRONOUS AND SYNCHRONOUS AND PROGRAMMABLE AND HIGH PERFORMANCE |
| INCLOSURE CONFIGURATION | FLAT PACK |
| INCLOSURE MATERIAL | PLASTIC |
| OPERATING TEMP RANGE | -40.0 TO 85.0 CELSIUS |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| OVERALL LENGTH | 21.9 MILLIMETERS MINIMUM AND 22.1 MILLIMETERS MAXIMUM |
| OVERALL WIDTH | 15.9 MILLIMETERS MINIMUM AND 16.1 MILLIMETERS MAXIMUM |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | 3.3 VOLT HIGH DENSITY SUPERSYNC II 36 BIT FIFO 65,536 X 36 |
| MEMORY DEVICE TYPE | FIRST-IN FIRST-OUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 3.3 VOLTS NOMINAL INPUT |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| TERMINAL TYPE AND QUANTITY | 128 GULLWING |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TIME RATING PER CHACTERISTIC | 15.00 NANOSECONDS NOMINAL ACCESS |