BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.090 INCHES MAXIMUM |
BODY LENGTH | 0.640 INCHES MAXIMUM |
BODY WIDTH | 0.300 INCHES MINIMUM AND 0.420 INCHES MAXIMUM |
FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE AND SCHOTTKY |
INCLOSURE CONFIGURATION | FLAT PACK |
INCLOSURE MATERIAL | CERAMIC |
INPUT CIRCUIT PATTERN | 13 INPUT |
OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
MAXIMUM POWER DISSIPATION RATING | 1.02 WATTS |
MEMORY CAPACITY | 512 WORD X 8 BIT |
MEMORY DEVICE TYPE | PROM |
OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT, DIGITAL PROM 512 X 8-BIT, BIPOLAR |
STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
TERMINAL SURFACE TREATMENT | SOLDER |
TERMINAL TYPE AND QUANTITY | 24 FLAT LEADS |
TIME RATING PER CHACTERISTIC | 90.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 90.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |