| DESIGN FUNCTION AND QUANTITY | 1 INTEGRATOR |
| BODY HEIGHT | 0.270 INCHES MAXIMUM |
| BODY LENGTH | 1.200 INCHES MAXIMUM |
| BODY WIDTH | 1.000 INCHES MAXIMUM |
| CRITICALITY CODE JUSTIFICATION | CBBL |
| FEATURES PROVIDED | ELECTROSTATIC SENSITIVE |
| HYBRID TECHNOLOGY TYPE | MULTICHIP |
| INCLOSURE CONFIGURATION | PIN GRID ARRAY |
| INCLOSURE MATERIAL | METAL |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT, HYBRID, ELECTRONIC COMPONENTS ASSEMBLY - INTEGRATOR AND SWITCHING LOGIC |
| PRECIOUS MATERIAL | GOLD |
| PRECIOUS MATERIAL AND LOCATION | TERMINALS GOLD |
| PROPRIETARY CHARACTERISTICS | PACS |
| MAXIMUM POWER DISSIPATION RATING | 350.0 MILLIWATTS |
| OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| OVERALL HEIGHT | 0.445 INCHES MAXIMUM |
| OVERALL LENGTH | 1.200 INCHES MAXIMUM |
| OVERALL WIDTH | 1.000 INCHES MAXIMUM |
| SPECIAL FEATURES | MORE RELIABLE REPLACEMENT FOR MODULE PIN 8500358-903 |
| SPECIFICATION/STANDARD DATA | 81349-MIL-PRF-38534 GOVERNMENT SPECIFICATION |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -16.5 VOLTS MINIMUM POWER SOURCE AND 16.5 VOLTS MAXIMUM POWER SOURCE |
| STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| TERMINAL TYPE AND QUANTITY | 16 PIN |
| TERMINAL SURFACE TREATMENT | GOLD |