BODY HEIGHT | 0.070 INCHES MINIMUM AND 0.145 INCHES MAXIMUM |
BODY LENGTH | 1.140 INCHES MINIMUM AND 1.180 INCHES MAXIMUM |
BODY WIDTH | 1.140 INCHES MINIMUM AND 1.180 INCHES MAXIMUM |
CAPITANCE RATING PER CHARACTERISTIC | 0.01 INPUT NANOFARADS MAXIMUM AND 0.02 OUTPUT NANOFARADS MAXIMUM |
CASE OUTLINE SOURCE AND DESIGNATOR | P-AC MIL-M-38510 |
CURRENT RATING PER CHARACTERISTIC | 160.00 MILLIAMPERES MAXIMUM SUPPLY |
DESIGN FUNCTION AND QUANTITY | 1 MICROPROCESSOR |
FEATURES PROVIDED | MONOLITHIC AND W/CLOCK AND SYNCHRONOUS AND ASYNCHRONOUS |
INCLOSURE CONFIGURATION | PIN GRID ARRAY |
INCLOSURE MATERIAL | CERAMIC |
INPUT CIRCUIT PATTERN | 35 INPUT |
OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
OVERALL HEIGHT | 0.230 INCHES MINIMUM AND 0.345 INCHES MAXIMUM |
OVERALL LENGTH | 1.140 INCHES MINIMUM AND 1.180 INCHES MAXIMUM |
OVERALL WIDTH | 1.140 INCHES MINIMUM AND 1.180 INCHES MAXIMUM |
PART NAME ASSIGNED BY CONTROLLING AGENCY | CHMOS MICROPROCESSOR |
MAXIMUM POWER DISSIPATION RATING | 3.0 WATTS |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.0 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
TERMINAL SURFACE TREATMENT | SOLDER |
TERMINAL TYPE AND QUANTITY | 68 PIN |
TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |