OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
OVERALL HEIGHT | 0.400 INCHES MAXIMUM |
OVERALL WIDTH | 0.290 INCHES MINIMUM AND 0.320 INCHES MAXIMUM |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
TERMINAL SURFACE TREATMENT | SOLDER |
TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
BODY HEIGHT | 0.185 INCHES MAXIMUM |
BODY LENGTH | 1.280 INCHES MAXIMUM |
BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
CASE OUTLINE SOURCE AND DESIGNATOR | D-9 MIL-M-38510 |
FEATURES PROVIDED | BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMED AND ULTRAVIOLET ERASABLE |
INCLOSURE CONFIGURATION | DUAL-IN-LINE |
INCLOSURE MATERIAL | CERAMIC |
INPUT CIRCUIT PATTERN | 22 INPUT |
PART NAME ASSIGNED BY CONTROLLING AGENCY | PAL ASSEMBLY,SYNC MUX/LBUS INTR. |
PROPRIETARY CHARACTERISTICS | PACS |
MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS |
MEMORY DEVICE TYPE | PROGRAMMED |