| BODY HEIGHT | 0.220 INCHES MAXIMUM |
| BODY LENGTH | 1.535 INCHES MAXIMUM |
| BODY WIDTH | 1.150 INCHES MAXIMUM |
| FEATURES PROVIDED | HYBRID AND HERMETICALLY SEALED AND BURN IN AND POSITIVE OUTPUTS AND ELECTROSTATIC SENSITIVE |
| HYBRID TECHNOLOGY TYPE | MONOLITHIC |
| INCLOSURE CONFIGURATION | FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC |
| OPERATING TEMP RANGE | -40.0 TO 85.0 CELSIUS |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| OVERALL HEIGHT | 0.220 INCHES MAXIMUM |
| OVERALL LENGTH | 1.535 INCHES MAXIMUM |
| OVERALL WIDTH | 2.090 INCHES NOMINAL |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | FUNCTION DRIVER,BUBBLE MEMORY |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 20.0 VOLTS MAXIMUM POWER SOURCE |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TIME RATING PER CHACTERISTIC | 100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY |