| BODY HEIGHT | 0.080 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| BODY LENGTH | 1.308 INCHES MINIMUM AND 1.332 INCHES MAXIMUM |
| BODY WIDTH | 1.308 INCHES MINIMUM AND 1.332 INCHES MAXIMUM |
| CURRENT RATING PER CHARACTERISTIC | 150.00 MILLIAMPERES MAXIMUM SUPPLY |
| DESIGN FUNCTION AND QUANTITY | 1 MICROPROCESSOR |
| FEATURES PROVIDED | HYBRID AND HERMETICALLY SEALED AND BURN IN AND W/CLOCK AND ELECTROSTATIC SENSITIVE |
| INCLOSURE CONFIGURATION | PIN GRID ARRAY |
| INCLOSURE MATERIAL | CERAMIC |
| INPUT CIRCUIT PATTERN | 62 INPUT |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| OVERALL HEIGHT | 0.280 INCHES NOMINAL |
| OVERALL LENGTH | 1.308 INCHES MINIMUM AND 1.332 INCHES MAXIMUM |
| OVERALL WIDTH | 1.308 INCHES MINIMUM AND 1.332 INCHES MAXIMUM |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | GATE ARRAY,ASIC COMBINATION LOGIC |
| MAXIMUM POWER DISSIPATION RATING | 900.0 MILLIWATTS |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| TERMINAL TYPE AND QUANTITY | 120 PIN |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TIME RATING PER CHACTERISTIC | 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY |