BODY HEIGHT | 0.185 INCHES MAXIMUM |
BODY LENGTH | 1.280 INCHES MAXIMUM |
BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
CASE OUTLINE SOURCE AND DESIGNATOR | D-9 MIL-M-38510 |
FEATURES PROVIDED | BIDIRECTIONAL AND BURN IN AND ELECTROSTATIC SENSITIVE AND ERASABLE AND PROGRAMMED |
INCLOSURE CONFIGURATION | DUAL-IN-LINE |
INCLOSURE MATERIAL | CERAMIC |
INPUT CIRCUIT PATTERN | 22 INPUT |
OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
OVERALL HEIGHT | 0.400 INCHES MAXIMUM |
OVERALL WIDTH | 0.290 INCHES MINIMUM AND 0.320 INCHES MAXIMUM |
MAXIMUM POWER DISSIPATION RATING | 650.0 MILLIWATTS |
MEMORY DEVICE TYPE | PROGRAMMED |
PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT,DIGITAL-CMOS,ERASEABLE,PROGRAMMABLE LOGIC DEVICE |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -2.0 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
TERMINAL SURFACE TREATMENT | SOLDER |
TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TIME RATING PER CHACTERISTIC | 500.00 NANOSECONDS MAXIMUM INPUT |