DESIGN FUNCTION AND QUANTITY | 1 MICROPROCESSOR |
BODY HEIGHT | 0.094 INCHES NOMINAL |
BODY LENGTH | 1.086 INCHES MINIMUM AND 1.110 INCHES MAXIMUM |
BODY WIDTH | 1.086 INCHES MINIMUM AND 1.110 INCHES MAXIMUM |
CURRENT RATING PER CHARACTERISTIC | 40.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
FEATURES PROVIDED | W/CLOCK AND BIDIRECTIONAL AND BURN IN AND W/RESISTOR AND ELECTROSTATIC SENSITIVE AND MONOLITHIC |
INCLOSURE CONFIGURATION | PIN GRID ARRAY |
INCLOSURE MATERIAL | CERAMIC |
INPUT CIRCUIT PATTERN | 40 INPUT |
PART NAME ASSIGNED BY CONTROLLING AGENCY | ADVANCED ARCHITECTURE MICROPROCESSOR II |
PROPRIETARY CHARACTERISTICS | PACS |
OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
OVERALL HEIGHT | 0.274 INCHES NOMINAL |
OVERALL LENGTH | 1.086 INCHES MINIMUM AND 1.110 INCHES MAXIMUM |
OVERALL WIDTH | 1.086 INCHES MINIMUM AND 1.110 INCHES MAXIMUM |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.0 VOLTS MAXIMUM POWER SOURCE |
STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
TERMINAL SURFACE TREATMENT | SOLDER |
TERMINAL TYPE AND QUANTITY | 69 PIN |
TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |