| BODY HEIGHT | 0.064 INCHES MINIMUM AND 0.075 INCHES MAXIMUM |
| BODY LENGTH | 0.740 INCHES MINIMUM AND 0.760 INCHES MAXIMUM |
| BODY WIDTH | 0.740 INCHES MINIMUM AND 0.760 INCHES MAXIMUM |
| DESIGN FUNCTION AND QUANTITY | 1 MICROPROCESSOR |
| FEATURES PROVIDED | BURN IN AND MONOLITHIC |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC |
| INPUT CIRCUIT PATTERN | 27 INPUT |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| MAXIMUM POWER DISSIPATION RATING | 1.5 WATTS |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT,DIGITAL,CMOS,16-BIT MICROPROCESSOR |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 52 LEADLESS |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TIME RATING PER CHACTERISTIC | 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY |