| BODY HEIGHT | 0.090 INCHES MINIMUM AND 0.145 INCHES MAXIMUM |
| BODY LENGTH | 0.935 INCHES MINIMUM AND 0.970 INCHES MAXIMUM |
| BODY WIDTH | 0.935 INCHES MINIMUM AND 0.970 INCHES MAXIMUM |
| CURRENT RATING PER CHARACTERISTIC | 300.00 MILLIAMPERES MAXIMUM SUPPLY |
| FEATURES PROVIDED | BIDIRECTIONAL AND BURN IN AND ELECTROSTATIC SENSITIVE AND MEDIUM VOLTAGE AND PROGRAMMED AND ULTRAVIOLET ERASABLE |
| INCLOSURE CONFIGURATION | BEAM CHIP |
| INCLOSURE MATERIAL | CERAMIC |
| INPUT CIRCUIT PATTERN | 64 INPUT |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| OVERALL LENGTH | 1.640 INCHES MINIMUM AND 1.870 INCHES MAXIMUM |
| OVERALL WIDTH | 1.640 INCHES MINIMUM AND 1.870 INCHES MAXIMUM |
| MAXIMUM POWER DISSIPATION RATING | 1.5 WATTS |
| MEMORY DEVICE TYPE | PROGRAMMED |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT,PROGRAMMED(EWEGO DISK-8) |
| PRECIOUS MATERIAL | GOLD |
| PRECIOUS MATERIAL AND LOCATION | TERMINALS GOLD |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 68 BEAM LEAD |
| TIME RATING PER CHACTERISTIC | 90.00 NANOSECONDS MAXIMUM ACCESS |