BIT QUANTITY | 256 |
BODY HEIGHT | 0.185 INCHES MAXIMUM |
BODY LENGTH | 0.750 INCHES MINIMUM AND 0.830 INCHES MAXIMUM |
BODY WIDTH | 0.240 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
CURRENT RATING PER CHARACTERISTIC | 45.00 MILLIAMPERES MAXIMUM SUPPLY |
FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND LOW POWER AND PARALLEL OPERATION |
INCLOSURE CONFIGURATION | DUAL-IN-LINE |
INCLOSURE MATERIAL | CERAMIC |
INPUT CIRCUIT PATTERN | 7 INPUT |
OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
OVERALL HEIGHT | 0.375 INCHES MAXIMUM |
MAXIMUM POWER DISSIPATION RATING | 175.0 MILLIWATTS |
MEMORY DEVICE TYPE | FIRST-IN FIRST-OUT |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
WORD QUANTITY | 64 |
STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
TERMINAL SURFACE TREATMENT | SOLDER |
TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TIME RATING PER CHACTERISTIC | 35.00 NANOSECONDS MAXIMUM ACCESS |