BIT QUANTITY | 1024000 |
BODY HEIGHT | 0.285 INCHES MAXIMUM |
BODY LENGTH | 1.560 INCHES MINIMUM AND 1.640 INCHES MAXIMUM |
BODY WIDTH | 0.610 INCHES NOMINAL |
CURRENT RATING PER CHARACTERISTIC | 5.00 MILLIAMPERES MAXIMUM OUTPUT |
FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND BIDIRECTIONAL |
INCLOSURE CONFIGURATION | DUAL-IN-LINE |
INCLOSURE MATERIAL | CERAMIC |
INPUT CIRCUIT PATTERN | 28 INPUT |
OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
OVERALL HEIGHT | 0.500 INCHES MAXIMUM |
MAXIMUM POWER DISSIPATION RATING | 2.0 WATTS |
MEMORY DEVICE TYPE | EEPROM |
PART NAME ASSIGNED BY CONTROLLING AGENCY | MEMORY MODULE ASSEMBLY |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -500.0 MILLIVOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
WORD QUANTITY | 128000 |
STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
TERMINAL SURFACE TREATMENT | SOLDER |
TERMINAL TYPE AND QUANTITY | 32 PRINTED CIRCUIT |
TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TIME RATING PER CHACTERISTIC | 300.00 NANOSECONDS MAXIMUM ACCESS |