| BODY HEIGHT | 0.080 INCHES MINIMUM AND 0.140 INCHES MAXIMUM |
| BODY LENGTH | 1.440 INCHES MINIMUM AND 1.480 INCHES MAXIMUM |
| BODY WIDTH | 1.440 INCHES MINIMUM AND 1.480 INCHES MAXIMUM |
| CASE OUTLINE SOURCE AND DESIGNATOR | P-AF MIL-M-38510 |
| DESIGN FUNCTION AND QUANTITY | 1 MICROPROCESSOR |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND W/RESET AND W/CLOCK AND BIDIRECTIONAL |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| OVERALL HEIGHT | 0.395 INCHES MAXIMUM |
| MAXIMUM POWER DISSIPATION RATING | 2.4 WATTS |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 8 PRINTED CIRCUIT |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 10.0 VOLTS MAXIMUM POWER SOURCE |