BODY HEIGHT | 0.160 INCHES MAXIMUM |
BODY LENGTH | 1.060 INCHES MAXIMUM |
BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
FEATURES PROVIDED | W/ENABLE AND HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE |
INCLOSURE CONFIGURATION | DUAL-IN-LINE |
INCLOSURE MATERIAL | CERAMIC AND GLASS |
INPUT CIRCUIT PATTERN | 10 INPUT |
OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
MAXIMUM POWER DISSIPATION RATING | 907.0 MILLIWATTS |
MEMORY DEVICE TYPE | PROM |
OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
TERMINAL SURFACE TREATMENT | SOLDER |
TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TIME RATING PER CHACTERISTIC | 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |