| BODY HEIGHT | 0.098 INCHES MAXIMUM |
| BODY LENGTH | 0.970 INCHES MAXIMUM |
| BODY WIDTH | 0.970 INCHES MAXIMUM |
| CURRENT RATING PER CHARACTERISTIC | 600.00 MILLIAMPERES NOMINAL SUPPLY |
| DESIGN FUNCTION AND QUANTITY | 1 MICROPROCESSOR |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS |
| INCLOSURE CONFIGURATION | BEAM CHIP |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| INPUT CIRCUIT PATTERN | 30 INPUT |
| OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | 16-BIT N-CHANNEL MICROPROCESSOR |
| MAXIMUM POWER DISSIPATION RATING | 3.0 WATTS |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 68 BEAM LEAD |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.0 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |