BODY HEIGHT | 0.064 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
BODY LENGTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
BODY WIDTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
CURRENT RATING PER CHARACTERISTIC | 160.00 MICROAMPERES MAXIMUM SUPPLY |
DESIGN FUNCTION AND QUANTITY | 8 LATCH |
FEATURES PROVIDED | 3-STATE OUTPUT AND HIGH SPEED AND MONOLITHIC AND W/ENABLE |
INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
INCLOSURE MATERIAL | CERAMIC |
INPUT CIRCUIT PATTERN | 10 INPUT |
OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
TERMINAL SURFACE TREATMENT | SOLDER |
TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TIME RATING PER CHACTERISTIC | 53.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 53.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |