BODY HEIGHT | 0.185 INCHES MAXIMUM |
BODY LENGTH | 0.840 INCHES MAXIMUM |
BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
CASE OUTLINE SOURCE AND DESIGNATOR | D-2 MIL-M-38510 |
FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND SCHOTTKY AND PROGRAMMABLE AND W/ACTIVE PULL-UP |
INCLOSURE CONFIGURATION | DUAL-IN-LINE |
INCLOSURE MATERIAL | CERAMIC |
INPUT CIRCUIT PATTERN | 10 INPUT |
PROPRIETARY CHARACTERISTICS | PACS |
MAXIMUM POWER DISSIPATION RATING | 739.0 MILLIWATTS |
MEMORY CAPACITY | UNKNOWN |
MEMORY DEVICE TYPE | ROM |
OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
TERMINAL SURFACE TREATMENT | SOLDER |
TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TIME RATING PER CHACTERISTIC | 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |