BODY HEIGHT | 0.085 INCHES MINIMUM AND 0.115 INCHES MAXIMUM |
BODY LENGTH | 0.890 INCHES MINIMUM AND 0.910 INCHES MAXIMUM |
BODY WIDTH | 0.280 INCHES MINIMUM AND 0.305 INCHES MAXIMUM |
FEATURES PROVIDED | HERMETICALLY SEALED AND STATIC OPERATION AND 3-STATE OUTPUT |
INCLOSURE CONFIGURATION | DUAL-IN-LINE |
INCLOSURE MATERIAL | CERAMIC AND GLASS |
INPUT CIRCUIT PATTERN | 15 INPUT |
OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
MEMORY DEVICE TYPE | RAM |
STORAGE TEMP RANGE | -55.0 TO 150.0 CELSIUS |
TERMINAL SURFACE TREATMENT | SOLDER |
TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MAXIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |