BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.160 INCHES MAXIMUM |
BODY LENGTH | 0.750 INCHES MINIMUM AND 0.770 INCHES MAXIMUM |
BODY WIDTH | 0.285 INCHES MINIMUM AND 0.291 INCHES MAXIMUM |
FEATURES PROVIDED | DYNAMIC AND HERMETICALLY SEALED |
INCLOSURE CONFIGURATION | DUAL-IN-LINE |
INCLOSURE MATERIAL | CERAMIC |
INPUT CIRCUIT PATTERN | 11 INPUT |
OPERATING TEMP RANGE | -55.0 TO 110.0 CELSIUS |
OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
MAXIMUM POWER DISSIPATION RATING | 1000.0 MILLIWATTS |
MEMORY DEVICE TYPE | RAM |
STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
TERMINAL SURFACE TREATMENT | SOLDER |
TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 20.0 VOLTS MAXIMUM POWER SOURCE |