BODY HEIGHT | 0.106 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
BODY LENGTH | 0.745 INCHES MINIMUM AND 0.770 INCHES MAXIMUM |
BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
DESIGN FUNCTION AND QUANTITY | 4 GATE, AND |
FEATURES PROVIDED | HIGH RELIABILITY AND MONOLITHIC AND BURN IN |
INCLOSURE CONFIGURATION | DUAL-IN-LINE |
INCLOSURE MATERIAL | CERAMIC |
INPUT CIRCUIT PATTERN | QUAD 2 INPUT |
OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
OVERALL HEIGHT | 0.281 INCHES MINIMUM AND 0.350 INCHES MAXIMUM |
OVERALL LENGTH | 0.745 INCHES MINIMUM AND 0.770 INCHES MAXIMUM |
OVERALL WIDTH | 0.300 INCHES MINIMUM AND 0.325 INCHES MAXIMUM |
MAXIMUM POWER DISSIPATION RATING | 200.0 MILLIWATTS |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 18.0 VOLTS MAXIMUM POWER SOURCE |
STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |
TERMINAL SURFACE TREATMENT | SOLDER |
TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TIME RATING PER CHACTERISTIC | 320.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 420.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |