| BODY HEIGHT | 0.055 INCHES MINIMUM AND 0.125 INCHES MAXIMUM |
| BODY LENGTH | 0.735 INCHES MINIMUM AND 0.830 INCHES MAXIMUM |
| BODY WIDTH | 0.245 INCHES MINIMUM AND 0.295 INCHES MAXIMUM |
| FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND LOW POWER AND 3-STATE OUTPUT AND WIRE-OR OUTPUTS AND EXPANDABLE AND W/DECODED OUTPUT AND W/BUFFERED OUTPUT AND W/STORAGE |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| INPUT CIRCUIT PATTERN | 11 INPUT |
| OUTPUT LOGIC FORM | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| MEMORY CAPACITY | UNKNOWN |
| MEMORY DEVICE TYPE | ROM |
| OPERATING TEMP RANGE | +0.0 TO 70.0 CELSIUS |
| STORAGE TEMP RANGE | -65.0 TO 160.0 CELSIUS |
| TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TIME RATING PER CHACTERISTIC | 10.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 10.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -20.0 VOLTS MINIMUM POWER SOURCE AND 5.0 VOLTS MAXIMUM POWER SOURCE |