BODY HEIGHT | 0.070 INCHES MAXIMUM |
BODY LENGTH | 0.390 INCHES MAXIMUM |
BODY WIDTH | 0.390 INCHES MAXIMUM |
FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND BIPOLAR AND NEGATIVE OUTPUTS AND UNIPOLAR AND PROGRAMMABLE AND PROGRAMMED AND W/ENABLE AND WIRE-OR OUTPUTS |
INCLOSURE CONFIGURATION | FLAT PACK |
INCLOSURE MATERIAL | CERAMIC AND GLASS |
INPUT CIRCUIT PATTERN | 12 INPUT |
OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
OUTPUT LOGIC FORM | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
MAXIMUM POWER DISSIPATION RATING | 307.2 MILLIWATTS |
MEMORY CAPACITY | UNKNOWN |
MEMORY DEVICE TYPE | ROM |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -20.0 VOLTS MAXIMUM POWER SOURCE AND 8.3 VOLTS MAXIMUM POWER SOURCE |
STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
TERMINAL SURFACE TREATMENT | SOLDER |
TERMINAL TYPE AND QUANTITY | 30 FLAT LEADS |
TEST DATA DOCUMENT | 09128-D34005544 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
TIME RATING PER CHACTERISTIC | 900.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |