COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE |
CURRENT RATING PER CHARACTERISTIC | 120.00 AMPERES SOURCE CUTOFF CURRENT PEAK ALL SEMICONDUCTOR DEVICE DIODE AND 10.00 AMPERES FORWARD CURRENT, AVERAGE ABSOLUTE ALL SEMICONDUCTOR DEVICE DIODE |
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | T0-220 |
INCLOSURE MATERIAL | PLASTIC |
PROPRIETARY CHARACTERISTICS | PACS |
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 DEG CELSIUS JUNCTION |
MOUNTING FACILITY QUANTITY | 1 |
MOUNTING METHOD | UNTHREADED HOLE |
OVERALL HEIGHT | 0.190 INCHES MAXIMUM |
OVERALL LENGTH | 1.150 INCHES NOMINAL |
OVERALL WIDTH | 0.420 INCHES MAXIMUM |
SPECIAL FEATURES | ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN |
SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 36.0 MAXIMUM NONREPETITIVE PEAK REVERSE VOLTAGE ALL SEMICONDUCTOR DEVICE DIODE AND 30.0 MAXIMUM REVERSE VOLTAGE, DC ALL SEMICONDUCTOR DEVICE DIODE AND 30.0 MAXIMUM WORKING PEAK REVERSE VOLTAGE ALL SEMICONDUCTOR DEVICE DIODE |
TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |