5961-01-201-4485, SEMICONDUCTOR DEVICES,UNITIZED

5961-01-201-4484 SEMICONDUCTOR DEVICES,UNITIZED

5961-01-201-4486 SEMICONDUCTOR DEVICES,UNITIZED

National Stock Number:
5961-01-201-4485

Federal Supply Class:
5961

National Item Identification Number:
012014485

Description:
SEMICONDUCTOR DEVICES,UNITIZED

Detail:
Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.

Manufacturer Information:

JANTXV1N6101	81349	MILITARY SPECIFICATIONS PROMULGATED BY MILITARY DEPARTMENTS/AGENCIES UNDER AUTHORITY OF DEFENSE STANDARDIZATION MANUAL 4120 3-M
MIL-PRF-19500/474	81349	MILITARY SPECIFICATIONS PROMULGATED BY MILITARY DEPARTMENTS/AGENCIES UNDER AUTHORITY OF DEFENSE STANDARDIZATION MANUAL 4120 3-M
MIL-S-19500/474	81349	MILITARY SPECIFICATIONS PROMULGATED BY MILITARY DEPARTMENTS/AGENCIES UNDER AUTHORITY OF DEFENSE STANDARDIZATION MANUAL 4120 3-M

Techincal Specification:

COMPONENT NAME AND QUANTITY	8 SEMICONDUCTOR DEVICE DIODE
CURRENT RATING PER CHARACTERISTIC	200.00 MILLIAMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE ALL SEMICONDUCTOR DEVICE DIODE
FEATURES PROVIDED	HERMETICALLY SEALED CASE AND QUALITY ASSURANCE LEVEL TXV
INCLOSURE MATERIAL	GLASS
OVERALL HEIGHT	0.200 INCHES MAXIMUM
OVERALL LENGTH	0.785 INCHES MAXIMUM
OVERALL WIDTH	0.310 INCHES MAXIMUM
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT	175.0 CELSIUS AMBIENT AIR
MOUNTING METHOD	TERMINAL
SPECIAL FEATURES	ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN
POWER RATING PER CHARACTERISTIC	600.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION ALL SEMICONDUCTOR DEVICE DIODE
PRECIOUS MATERIAL	GOLD
PRECIOUS MATERIAL AND LOCATION	TERMINALS EXTERNAL SURFACE GOLD
SEMICONDUCTOR MATERIAL	SILICON ALL SEMICONDUCTOR DEVICE DIODE
SPECIFICATION/STANDARD DATA	81349-MIL-S-19500/474 GOVERNMENT SPECIFICATION
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC	75.0 MAXIMUM BREAKDOWN VOLTAGE, DC ALL SEMICONDUCTOR DEVICE DIODE
TERMINAL LENGTH	0.260 INCHES MAXIMUM
TERMINAL TYPE AND QUANTITY	16 PIN
TEST DATA DOCUMENT	81349-MIL-S-19500 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTING GENERAL TYPE DATA ON CERTAIN ENVIRONMENTAL AND PERFORMANCE REQUIREMENTS AND TEST CONDITIONS THAT ARE SHOWN AS "TYPICAL", "AVERAGE", "NOMINAL", ETC.).

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