III SEMICONDUCTOR MATERIAL | SILICON |
PROPRIETARY CHARACTERISTICS | PACS |
MOUNTING METHOD | CLIP |
OVERALL HEIGHT | 7.120 MILLIMETERS MINIMUM AND 8.120 MILLIMETERS MAXIMUM |
OVERALL LENGTH | 9.150 MILLIMETERS MINIMUM AND 10.410 MILLIMETERS MAXIMUM |
OVERALL WIDTH | 3.050 MILLIMETERS MINIMUM AND 4.820 MILLIMETERS MAXIMUM |
SPECIAL FEATURES | AREA STRAIGHT ABOVE HOLE SHALL BENOTCHED OUT |
TERMINAL LENGTH | 9.430 MILLIMETERS MINIMUM AND 13.200 MILLIMETERS MAXIMUM |
TERMINAL TYPE AND QUANTITY | 3 PIN |