5961-01-062-5742 TRANSISTOR Index 4820-01-062-5744 SEAT,VALVE

National Stock Number:
5961-01-062-5743

Federal Supply Class:
5961

National Item Identification Number:
010625743

Description:
TRANSISTOR

Detail:
An active semiconductor device with three or more electrodes. May or may not include mounting hardware and/or heatsink. Excludes SEMICONDUCTOR DEVICE, DIODE and SEMICONDUCTOR DEVICE, THYRISTOR. For solid state devices which are responsive to visible or infrared radiant energy, see SEMICONDUCTOR DEVICE, PHOTO.


Manufacturer Information:
1379-231019ALLEGRO MICROSYSTEMS INC
352-1059-01113499ROCKWELL COLLINS, INC.
352-1059-01195105ROCKWELL COLLINS, INC.
6203458135ACRIAN INC
CTX1396X04713FREESCALE SEMICONDUCTOR, INC.
PRT979301281TRW ELECTRONICS AND DEFENSE SECTOR RF DEVICES
RT-1016R3B150RAYTHEON COMPANY
RT-1016R49956RAYTHEON COMPANY
RT-1016R54X10RAYTHEON COMPANY
SD1379-H208JA0MICROSEMI CORP. - MONTGOMERYVILLE
SD1379-H257962STMICROELECTRONICS INC


Techincal Specification:
SEMICONDUCTOR MATERIALSILICON
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC55.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-BASE, EMITTER OPEN AND
33.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-EMITTER, BASE OPEN AND
3.5 MAXIMUM BREAKDOWN VOLTAGE, EMITTER-TO-BASE, COLLECTOR OPEN
CURRENT RATING PER CHARACTERISTIC250.00 MILLIAMPERES MAXIMUM COLLECTOR CURRENT, DC
POWER RATING PER CHARACTERISTIC5.0 WATTS MAXIMUM TOTAL POWER DISSIPATION
INCLOSURE MATERIALCERAMIC AND
METAL
TERMINAL TYPE AND QUANTITY4 RIBBON
OVERALL LENGTH0.640 INCHES NOMINAL
MOUNTING METHODTHREADED STUD
INTERNAL CONFIGURATIONJUNCTION CONTACT
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT200.0 DEG CELSIUS JUNCTION
MOUNTING FACILITY QUANTITY1
THREAD SERIES DESIGNATORUNC
NOMINAL THREAD SIZE0.164 INCHES
TEST DATA DOCUMENT13499-352-1059 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING)
PRECIOUS MATERIALGOLD
PRECIOUS MATERIAL AND LOCATIONCHIP METALLIZATION AND INTERNAL @WIRES GOLD
SPECIAL FEATURESCERAMIC CASE CONTAINS BERYLLIUM OXIDE - HANDLE AND DISPOSE IAW HAZMAT PROCEDURES; JUNCTION PATTERN ARRANGEMENT: NPN


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