5961-01-032-0315 SEMICONDUCTOR DEVICE ASSEMBLY Index 5340-01-032-0317 PLUG ASSEMBLY,SEALING

National Stock Number:
5961-01-032-0316

Federal Supply Class:
5961

National Item Identification Number:
010320316

Description:
SEMICONDUCTOR DEVICES,UNITIZED

Detail:
Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.


Manufacturer Information:
149C273H0197942NORTHROP GRUMMAN SYSTEMS CORPORATION
1906-025728480HEWLETT-PACKARD COMPANY
1906-025750434AVAGO TECHNOLOGIES US INC
720696-3805869RAYTHEON COMPANY
795475-273030HAMILTON SUNDSTRAND CORPORATION
85625400-0127963GENERAL DYNAMICS INFORMATION SYSTEMS INC. DBA GENERAL DYNAMICS ADVANCED INFORMATION SYSTEMS
FSA2619DM07263FAIRCHILD SEMICONDUCTOR CORP
FSA2619M07263FAIRCHILD SEMICONDUCTOR CORP
FSA2619M13715FAIRCHILD SEMICONDUCTOR CORP COMPONENTS GROUP SUB OF SCHLUMBERGER LTD
FSA2619M27014NATIONAL SEMICONDUCTOR CORPORATION
FSA2619P07263FAIRCHILD SEMICONDUCTOR CORP


Techincal Specification:
COMPONENT NAME AND QUANTITY8 SEMICONDUCTOR DEVICE DIODE
CURRENT RATING PER CHARACTERISTIC350.00 MILLIAMPERES MAXIMUM FORWARD CURRENT, DC ALL SEMICONDUCTOR DEVICE DIODE
INCLOSURE MATERIALPLASTIC
OVERALL HEIGHT0.060 INCHES MINIMUM AND 0.075 INCHES MAXIMUM
OVERALL LENGTH0.371 INCHES MINIMUM AND 0.409 INCHES MAXIMUM
OVERALL WIDTH0.247 INCHES MINIMUM AND 0.283 INCHES MAXIMUM
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT150.0 CELSIUS AMBIENT AIR
MOUNTING METHODPRESS FIT
SPECIAL FEATURESALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN
POWER RATING PER CHARACTERISTIC600.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION ALL SEMICONDUCTOR DEVICE DIODE
SEMICONDUCTOR MATERIALSILICON ALL SEMICONDUCTOR DEVICE DIODE
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC75.0 MAXIMUM WORKING PEAK REVERSE VOLTAGE ALL SEMICONDUCTOR DEVICE DIODE
TERMINAL TYPE AND QUANTITY16 RIBBON


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