5999-01-029-5449 MOUNTING PAD,ELECTRICAL-ELECTRON Index 4920-01-029-5451 DEMODULATOR

National Stock Number:
5961-01-029-5450

Federal Supply Class:
5961

National Item Identification Number:
010295450

Description:
SEMICONDUCTOR DEVICES,UNITIZED

Detail:
Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.


Manufacturer Information:
247ASC0942-00130003NAVAL AIR SYSTEMS COMMAND MANAGED ORIGINAL DESIGN ACTIVITY NOT MATERIAL/PARTS SUPPLIER
304270-126916NORTHROP GRUMMAN SYSTEMS CORPORATION
304270-215280NORTHROP GRUMMAN SYSTEMS CORPORATION DIV ES DEFENSIVE SYSTEMS DIVISION
304270-226916NORTHROP GRUMMAN SYSTEMS CORPORATION
FSA1410M07263FAIRCHILD SEMICONDUCTOR CORP
FSA1410MQB07263FAIRCHILD SEMICONDUCTOR CORP
TS-240954485MICROSEMI CORP.- MASSACHUSETTS DBA MICROSEMI LAWRENCE


Techincal Specification:
COMPONENT NAME AND QUANTITY8 SEMICONDUCTOR DEVICE DIODE
CURRENT RATING PER CHARACTERISTIC350.00 MILLIAMPERES MAXIMUM FORWARD CURRENT, DC ALL SEMICONDUCTOR DEVICE DIODE
FEATURES PROVIDEDHERMETICALLY SEALED CASE
INCLOSURE MATERIALMETAL
OVERALL DIAMETER0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM
OVERALL LENGTH0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT150.0 CELSIUS AMBIENT AIR
MOUNTING METHODTERMINAL
SPECIAL FEATURESALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN
POWER RATING PER CHARACTERISTIC600.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION ALL SEMICONDUCTOR DEVICE DIODE
SEMICONDUCTOR MATERIALSILICON ALL SEMICONDUCTOR DEVICE DIODE
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC55.0 MAXIMUM WORKING PEAK REVERSE VOLTAGE ALL SEMICONDUCTOR DEVICE DIODE
TERMINAL CIRCLE DIAMETER0.230 INCHES NOMINAL
TERMINAL LENGTH0.500 INCHES MINIMUM
TERMINAL TYPE AND QUANTITY9 UNINSULATED WIRE LEAD


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