ACCOMMODATED CONTACT QUANTITY | 6 |
BODY MATERIAL | PLASTIC |
BODY MOUNTING HOLE ACCOMMODATION DIAMETER | 0.370 INCHES MINIMUM AND 0.375 INCHES MAXIMUM |
BODY STYLE | TOP MOUNT, PRESS FIT |
CONTACT MATERIAL | BERYLLIUM COPPER |
CONTACT POSITION ARRANGEMENT STYLE | CIRCULAR |
CONTACT RESISTANCE IN OHMS | 0.009 |
CONTACT MAXIMUM CURRENT RATING IN AMPS | 1.0 |
CONTACT SURFACE TREATMENT | GOLD AND NICKEL |
FABRICATION METHOD | MOLDED |
OVERALL DIAMETER | 0.390 INCHES MINIMUM AND 0.410 INCHES MAXIMUM |
OVERALL HEIGHT | 0.408 INCHES NOMINAL |
MOUNTING METHOD | PRESS FIT |
MOUNTING HOLE STYLE | ROUND, BODY |
MOUNTING TYPE FOR WHICH DESIGNED | CHASSIS |
POLARIZATION TYPE | SLOT |
PRECIOUS MATERIAL AND LOCATION | C0NTACT SURFACES GOLD |
PRECIOUS MATERIAL | GOLD |
PRECIOUS MATERIAL AND WEIGHT | 0.006 GOLD GRAINS, TROY |
PROJECTION LENGTH ABOVE MOUNTING SURFACE | 0.062 INCHES NOMINAL |
SPECIFIC EQUIPMENT ACCOMMODATED | SEMICONDUCTOR DEVICE |
TEMP RATING | -65.0 CELSIUS AND 150.0 CELSIUS |
TERMINAL LENGTH | 0.141 INCHES NOMINAL |
TERMINAL TYPE AND QUANTITY | 6 SOLDER WELL |