| ACCOMMODATED CONTACT QUANTITY | 4 |
| BODY DIAMETER | 0.330 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| BODY MATERIAL | CERAMIC |
| BODY STYLE | TOP MOUNT |
| CONTACT MATERIAL | BERYLLIUM COPPER |
| CONTACT POSITION ARRANGEMENT STYLE | RECTANGULAR |
| CONTACT RESISTANCE IN OHMS | 0.050 |
| CONTACT SURFACE TREATMENT | GOLD AND SILVER |
| DISTANCE BETWEEN MOUNTING FACILITY CENTERS | 0.560 INCHES MINIMUM AND 0.580 INCHES MAXIMUM |
| FABRICATION METHOD | MOLDED |
| OVERALL LENGTH | 0.730 INCHES MINIMUM AND 0.770 INCHES MAXIMUM |
| MOUNTING HOLE DIAMETER | 0.090 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| MOUNTING METHOD | BODY THROUGH HOLE |
| MOUNTING HOLE STYLE | TWO MOUNTING HOLES/SLOTS, IN-LINE |
| MOUNTING TYPE FOR WHICH DESIGNED | CHASSIS |
| POLARIZATION TYPE | CONTACT POSITION |
| PRECIOUS MATERIAL AND LOCATION | CONTACT SURFACES GOLD AND CONTACT SURFACES SILVER |
| PRECIOUS MATERIAL | GOLD AND SILVER |
| PRECIOUS MATERIAL AND WEIGHT | 0.020 GOLD GRAINS, TROY AND 0.020 SILVER GRAINS, TROY |
| SPECIFIC EQUIPMENT ACCOMMODATED | SEMICONDUCTOR DEVICE |
| TEMP RATING | -65.0 CELSIUS AND 135.0 CELSIUS |
| TERMINAL TYPE AND QUANTITY | 4 TAB, SOLDER LUG |