| BODY HEIGHT | 0.020 INCHES MINIMUM AND 0.051 INCHES MAXIMUM |
| BODY LENGTH | 0.117 INCHES MINIMUM AND 0.133 INCHES MAXIMUM |
| BODY STYLE | CHIP TYPE |
| BODY WIDTH | 0.049 INCHES MINIMUM AND 0.070 INCHES MAXIMUM |
| CAPACITANCE VALUE PER SECTION | 120.000 PICOFARADS SINGLE SECTION |
| DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT | 0.150 |
| MATERIAL | CERAMIC CASE |
| NONDEFINITIVE SPEC/STD DATA | 81349 MIL-PRF-55681/8 REFERENCE NUMBER |
| NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION | 100.0 DC SINGLE SECTION |
| NONDERATED OPERATING TEMP | -55.0 CELSIUS MINIMUM AND 125.0 CELSIUS MAXIMUM |
| PRECIOUS MATERIAL AND LOCATION | BONDING PADS OVER ELECTODES SILVER |
| RELIABILITY FAILURE RATE LEVEL IN PERCENT | 0.001 |
| RELIABILITY INDICATOR | ESTABLISHED |
| SCHEMATIC DIAGRAM DESIGNATOR | NO COMMON OR GROUNDED ELECTRODE(S) |
| SECTION QUANTITY | 3 |
| SPECIAL FEATURES | BASE METALIZATION: BARRIER METAL - TINNED (TIN OR TIN/LEAD ALLOY); SOLDERGUARD II |
| SPECIFICATION/STANDARD DATA | 81349 - CDR32B+121BKWS GOVERNMENT SPECIFICATION |
| TERMINAL LENGTH | 0.012 INCHES MINIMUM AND 0.021 INCHES MAXIMUM |
| TERMINAL TYPE AND QUANTITY | 2 BONDING PAD |
| TOLERANCE RANGE PER SECTION | -10.00 TO 10.00 PERCENT SINGLE SECTION |