| BODY HEIGHT | 0.020 INCHES MINIMUM AND 0.057 INCHES MAXIMUM |
| BODY LENGTH | 0.055 INCHES NOMINAL |
| BODY WIDTH | 0.055 INCHES NOMINAL |
| BODY STYLE | CHIP TYPE |
| CAPACITANCE VALUE PER SECTION | 2.200 PICOFARADS SINGLE SECTION |
| CASE MATERIAL | CERAMIC |
| DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT | 0.150 |
| INSULATION RESISTANCE AT MAXIMUM OPERATING TEMP | 100000.0 MEGOHMS |
| INSULATION RESISTANCE AT REFERENCE TEMP | 1000000.0 MEGOHMS |
| NONDERATED OPERATING TEMP | -55.0 CELSIUS MINIMUM AND 125.0 CELSIUS MAXIMUM |
| NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION | 50.0 DC SINGLE SECTION |
| RELIABILITY FAILURE RATE LEVEL IN PERCENT | 1.0000 |
| RELIABILITY INDICATOR | ESTABLISHED |
| SCHEMATIC DIAGRAM DESIGNATOR | NO COMMON OR GROUNDED ELECTRODE(S) |
| TEMP COEFFICIENT OF CAPACITANCE PER SECTION IN PPM PER DEG CELSIUS | 0.0 SINGLE SECTION |
| TERMINAL LENGTH | 0.015 INCHES MINIMUM |
| TERMINAL TYPE AND QUANTITY | 2 BONDING PAD |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TOLERANCE OF TEMP COEFFICIENT PER SECTION IN PPM PER DEG CELSIUS | -30.0 TO 30.0 SINGLE SECTION |
| TOLERANCE RANGE PER SECTION | -0.10 TO 0.10 PICOFARADS SINGLE SECTION |