| BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| BODY LENGTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| BODY WIDTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
| CURRENT RATING PER CHARACTERISTIC | 130.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
| FEATURES PROVIDED | BIDIRECTIONAL AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMABLE |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC |
| INPUT CIRCUIT PATTERN | 18 INPUT |
| OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| OVERALL HEIGHT | 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| OVERALL LENGTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| OVERALL WIDTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | AND-OR ARRAY |
| MAXIMUM POWER DISSIPATION RATING | 1.5 WATTS |
| MEMORY DEVICE TYPE | PAL |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |