BODY HEIGHT | 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM |
BODY LENGTH | 1.490 INCHES MAXIMUM |
BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510 |
CURRENT RATING PER CHARACTERISTIC | 80.00 MILLIAMPERES MAXIMUM SUPPLY |
FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMABLE |
INCLOSURE CONFIGURATION | DUAL-IN-LINE |
INCLOSURE MATERIAL | CERAMIC |
INPUT CIRCUIT PATTERN | 26 INPUT |
OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
OVERALL HEIGHT | 0.432 INCHES MAXIMUM |
OVERALL LENGTH | 1.490 INCHES MAXIMUM |
MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
MEMORY DEVICE TYPE | EEPROM |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM TOTAL SUPPLY AND 6.25 VOLTS MAXIMUM TOTAL SUPPLY |
STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
TERMINAL SURFACE TREATMENT | SOLDER |
TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TIME RATING PER CHACTERISTIC | 90.00 NANOSECONDS MAXIMUM ACCESS |