| CURRENT RATING PER CHARACTERISTIC | 30.00 MILLIAMPERES SOURCE CUTOFF CURRENT MAXIMUM |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| INTERNAL CONFIGURATION | JUNCTION CONTACT |
| III SEMICONDUCTOR MATERIAL | SILICON |
| INCLOSURE MATERIAL | GLASS |
| POWER RATING PER CHARACTERISTIC | 250.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR ABSOLUTE |
| PROPRIETARY CHARACTERISTICS | PACS |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS JUNCTION |
| MOUNTING METHOD | TERMINAL |
| OVERALL DIAMETER | 0.092 INCHES MINIMUM AND 0.108 INCHES MAXIMUM |
| OVERALL LENGTH | 0.071 INCHES MAXIMUM |
| SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: PNP |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | -20.0 MAXIMUM COLLECTOR TO BASE VOLTAGE/STATIC/EMITTER OPEN AND -12.0 MAXIMUM COLLECTOR TO EMITTER VOLTAGE/STATIC/BASE OPEN AND -3.0 MAXIMUM EMITTER TO BASE VOLTAGE, STATIC, COLLECTOR OPEN |
| TERMINAL LENGTH | 0.157 INCHES MINIMUM |
| TERMINAL TYPE AND QUANTITY | 4 RIBBON |
| TRANSFER RATIO | 20.0 MINIMUM STATIC FORWARD CURRENT TRANSFER RATIO, COMMON-EMITTER AND 200.0 MAXIMUM STATIC FORWARD CURRENT TRANSFER RATIO, COMMON-EMITTER |